HDI PCB Manufacturing
High Density Interconnect (HDI) PCBs represent the cutting edge of printed circuit board technology, featuring higher circuitry density and significantly more complex interconnections per unit area. These advanced boards utilize micro vias, buried vias, and blind vias to achieve maximum circuit density and superior electrical performance, making them ideal for modern compact electronic devices requiring high-speed signal transmission.
Manufacturing Process
Material Selection
High-grade substrates
Laser Drilling
Micro via formation
Layer Stack-up
Sequential lamination
Quality Assurance
Performance validation
Technical Specifications
| Layer Count | 4-32 layers |
| Minimum Via Size | 0.075mm (3mil) |
| Line Width/Spacing | 0.050mm (2mil) |
| Aspect Ratio | Up to 12:1 |
Applications
Mobile Devices
Smartphones, tablets, wearables
Computing
Laptops, servers, networking
Digital Cameras
Professional and consumer cameras
Advantages & Considerations
Advantages
- Higher circuit density
- Reduced board size
- Better signal integrity
- Enhanced reliability
Design Considerations
- Advanced manufacturing process
- Higher production costs
- Complex design rules
- Stringent quality control
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